| 应用: |
| * |
PWB conductor adhesives and
plating-through-hole (PTH) 阻抗评估; |
| * |
Sockets, relays, switches 等连接部位阻抗评估; |
| * |
无铅焊接 (lead-free solder joint ) 可靠度評估; |
| * |
BGA, CSP 焊球连接可靠度评估; |
| * |
芯片电容器连接可靠度评估; |
| * |
异类金属连接可靠度评估。 |
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| FEATURES: |
| * |
PWB conductor adhesives and plating-through-hole (PTH) impedance evaluation; |
| * |
Impedance evaluation in sockets, relays, switches and other joint parts; |
| * |
Reliability evaluation for Lead-free solder joint; |
| * |
Reliability evaluation for BGA and CSP welding ball joint; |
| * |
Reliability evaluation for chip capacitor joint; |
| * |
Reliability evaluation for aberrant metal joint. |